IoT/M2M/V2V Channel - Latest News & Content Related to IoT

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Autotech Council Member Anritsu Co. (booth #9046) will showcase its industry-leading test solutions that efficiently and accurately verify connected car designs at the Automotive Test Expo, to be held October 25-27, Novi, Michigan. In addition to product demonstrations, Anritsu is also an Open Technology Forum participant and will present a roadmap on LTE and how to test connected car systems using wireless technology, highlighting the global test company’s leadership position in the new generation of automotive designs.

The Institute of Electrical and Electronics Engineers (IEEE) Wireless and Microwave Technology Conference (WAMICON), announced the 18th annual event which will take place in Cocoa Beach, Fla. The conference, which will focus on power amplifiers, semiconductors and software for 5G wireless communications and the Internet of Things (IoT), will take place from April 24-25, 2017.

Leti, an institute of CEA Tech, and the Institute for Information Industry of Taiwan (III), a non-profit non-governmental technology development organization, today announced an agreement for mutual exploration of a wide range of information and communications technology (ICT) related to the Internet of Things (IoT) and 5G wireless connectivity.

Antenova is no stranger to requests from its customers to cram its tiny antennas into various M2M and Internet of Things (IoT) applications, from wearable glucose monitoring sensors to SMART watches and even the latest SMART Bluetooth enabled solar-powered bike U-clamp locks from Lattis.

APAC headed-up by China, is now driving the IoT market, along with new players such as Brazil and Russia, according to the latest report from Beecham Research.

Antenova Ltd., manufacturer of antennas and RF antenna modules for M2M and the Internet of Things, is announcing Beltii, (P/N SR4G013), a brand new embedded antenna which measures only 15.6 mm x 3.3 mm x 4.4 mm, and operates with all global public satellite constellations.

Texas Instruments (TI) announced availability for mass production of the industry's lowest-power, dual-band wireless microcontroller (MCU) supporting sub-1 GHz and Bluetooth® low energy connectivity on a single chip.

Huawei has launched its first Enterprise Solution Partner Program, which will offer powerful support to companies that jointly develop solutions with Huawei to serve global customers.

The Weightless SIG announced availability of Weightless-P hardware and the pre-launch of a Weightless-P Software Development Kit. In conjunction with Weightless Vendor partner, Antenova, Weightless-P hardware is to be shown at CTIA SuperMobility in Las Vegas, September 7-9. A limited number of free Weightless-P SDKs will be made available to developers in an offer specific to the show.