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Renesas Electronics Corporation and Altran and part of the Capgemini Group announced that they have co-developed a wearable solution for social distancing based on ultra-wideband (UWB) technology.
The breakthrough MAX77655 single-inductor multiple output (SIMO) power management IC (PMIC) from Maxim Integrated Products, Inc. provides the highest density power solution for extremely compact next-generation devices.
The LoRa Alliance® announced the release of Regional Parameters RP2-1.0.2, which includes support for all versions of the LoRaWAN® Layer 2 Specification.
The LoRa Alliance®, the global association of companies backing the open LoRaWAN® standard for internet of things (IoT) low-power wide-area networks (LPWANs), announced that it published the LoRaWAN TS1-1.0.4 Link Layer (L2) Specification.
EvoNexus and GLOBALFOUNDRIES® (GF®) announced their collaboration to accelerate the growth of semiconductor startups developing breakthrough products in wireless and the Internet of Things (IoT).
NXP Semiconductors has introduced two ultra-wideband ICs for IoT applications requiring fine range, high precision location sensing, such as smart locks and real-time location system tags.