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The IEEE MTT-S 2015 International Microwave Symposium (IMS) will debut Microwave Week’s first Wearables + Wireless Pavilion featuring emerging wearable electronics that utilize RF and microwave technologies. Curated and sponsored by Intel and Wireless Design and Development, the pavilion will be located at Booth #307 in the Phoenix Convention Center as part of the symposium May 17-22, 2015.

Microwave Development Laboratories Inc. will offer a sampling of its extensive expertise and product lines based on high-performance waveguide technology at the upcoming 2015 IEEE International Microwave Symposium and exhibition scheduled for May 17-22, 2015 in Phoenix, Ariz.

Q Microwave will be showcasing their integrated filter assembly products at IMS2015 in Phoenix,Ariz. May 17-22, Booth #1814.

Global connectivity supplier HUBER+SUHNER is once again proving its extensive expertise in RF and microwave applications at the International Microwave Symposium in Phoenix, 17-22 May 2015, with the launch of new cable assemblies designed for the space, defense and test and measurement markets.

Transline Technology Inc. announced  that they will be hosting a booth at the IMS tradeshow, May 19-21, 2015, at the Phoenix Convention Center in Ariz. Transline Technology is a printed circuit board (PCB) manufacturer, based in Anaheim, Calif., which specializes in RF and Microwave applications. TTi has been in business for over 20 years. This will be the sixth year Transline has been an exhibitor at IMS, and considers this tradeshow to be their most important of the year.

RADX Technologies will demo the LibertyGT 1211B COTS, modular, multifunction software defined synthetic instrument (SDSI) at IEEE IMS 2015, Booth # 310.

Richardson RFPD Inc. announces its attendance and participation at the 2015 IEEE MTT International Microwave Symposium (IMS), the premiere international gathering for all aspects of microwave theory and practice.

MACOM designers used NI AWR Design Environment™ software inclusive of Microwave Office circuit design software, AXIEM 3D planar EM simulator, Analyst™ 3D FEM simulator, and APLAC harmonic balance (HB) simulator to successfully design and simulate a 4 W Ka-band PA using a 2 mil thick 0.15 um GaAs pseudomorphic high-electron mobility transistor (pHEMT) process.