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Qorvo® announced that it has acquired NextInput, a pioneer in the emerging field of force-sensing solutions for human-machine interface (HMI).The acquisition of NextInput enables Qorvo to accelerate the deployment of force-sensing solutions utilizing MEMS-based sensors.
The new FemtoClock2 family includes ultra-low jitter clock generators and jitter attenuators in a small 4 x 4 mm2 package, enabling cost-effective and simple clock tree implementation for next-generation, high speed interconnect designs.
MACOM Technology Solutions Inc.'s new high voltage capacitor semiconductor process is capable of achieving kilovolt (KV) operating levels in excess of 1,000 V, a level not previously achieved with silicon semiconductor technology.
Cree | Wolfspeed introduced four, multi-stage GaN on SiC MMIC devices, extending its range of RF solutions for X-Band, pulsed and CW phased array applications, including marine, weather surveillance and emerging unmanned aerial system radars.
pSemi® announced the opening of a new design center in Chennai, India, to support the company's growing demand for semiconductor products for 5G and IoT applications.
The RF Front-End Module Comparison 2021 – Vol. 1 – Focus on Apple report provides insights into technology and cost data for RF front-end modules and a selection of components found in 18 smartphones from the Apple iPhone since 2016.
SCALINX, a fabless semiconductor company specialized in advanced signal conversion chips, announced it has secured global financing of 10.5 million euros.
BeRex has launched a family of power GaN FETs offering improved current efficiency with excellent gain and power performance, designed for C-, X-, Ku- and K-Band amplifiers.
SiTune announced two transceivers for 5G open RAN infrastructure hardware solutions — IceWings and SnowWings — which SiTune says are the first multi-standard, ultra-wideband transceivers differentiated by lower power consumption and lower cost than competing transceivers.