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Custom MMIC is proud to be this year’s recipient of the Massachusetts Manufacturer of the Year Award for the Eastern Massachusetts Middlesex District.

Mini-Circuits has expanded its amplifier design capabilities with a design engineering group dedicated to developing high-power amplifiers up to and beyond 1 kW through 8 GHz.

NXP Semiconductors and Sivers IMA plan to offer integrated solutions for 5G, combining NXP’s Layerscape programmable baseband with Sivers IMA’s 5G New Radio (NR) RFICs and phased-array antennas, targeting applications such as fixed wireless access.

Qualcomm Technologies announced a reference design for 5G-based fixed wireless access home gateways, which will enable mobile operators to offer broadband services that compete with cable, fiber to the home and DSL. Qualcomm’s reference design pairs the Snapdragon™ X55 5G Modem-RF System with the Networking Pro 1200 platform for Wi-Fi 6.

IEEE announced the 2019 release of the Heterogeneous Integration Roadmap, outlining the future of electronics with technology requirements and potential solutions.

Teledyne e2v HiRel has released a 60 GHz radiation tolerant, SPDT reflective switch developed for high-reliability space and defense applications. The TDSW0602T, available as a flip chip die, has low insertion loss, high isolation, fast switching time and high linearity from 20 kHz to 60 GHz.

WIN Semiconductors is offering a sample kit for its 0.15 μm GaN on SiC process. Supporting full MMICs with through-wafer vias, the platform can be used to design linear or saturated power amplifiers operating to 35 GHz.

Qorvo has acquired Cavendish Kinetics (CK), a supplier of RF switch products using MEMS technology to achieve low insertion loss, high isolation and small size.