Industrial/Scientific/Medical Channel - ISM Frequency Content Related to RF/Microwave Technology

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Amphenol® RF, the premier global RF solutions provider, has released a new line of rugged ronnectors (ARC) for the industrial, military, wireless, public safety, transportation and other outdoor and harsh environment applications.

Murata Electronics North America Inc. and its parent company Murata Manufacturing Co. Ltd., the world’s number one supplier of passive electronic components, announced that it has closed the deal to acquire RF Monolithics Inc. (hereinafter referred to as “RFM”). The cash transaction paid the holders of RFM common shares $1.78 per share.

Laird Technologies Inc., a designer and supplier of customized performance-critical components and systems for advanced electronics and wireless products, announced it will be attending the 2012 International Microwave Symposium and Exhibition. The event is taking place at the Palais des Congrès de Montréal in Montreal, Canada, June 19-21, 2012. Emerson & Cuming Microwave Products, a unit of Laird Technologies can be found at booth #2308.

Mercury Computer Systems Inc. (www.mc.com), a trusted provider of commercially developed application-ready ISR and EW subsystems for defense prime contractors, announced that it has signed a definitive agreement to acquire Micronetics Inc. (www.micronetics.com), a leading designer and manufacturer of microwave and radio frequency (RF) subsystems and components for defense and commercial customers.

Researchers at MIT have found a new way of making complex three-dimensional structures using self-assembling polymer materials that form tiny wires and junctions. The work has the potential to usher in a new generation of microchips and other devices made up of submicroscopic features.

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.

Harris Corp. has been awarded a two-year, $19 million contract by the U.S. Department of Veterans Affairs Office of Information and Technology to create a wireless network infrastructure for medical centers nationwide.

Analog Devices Inc. has appointed Somshubhro (Som) Pal Choudhury as managing director for operations in India. Pal Choudhury will manage Analog Devices’ presence in the country specifically defining and executing strategies to expand business by further developing and strengthening ADI’s relationships with strategic customers, the government and local universities.

CPI International Holding Corp. and its wholly owned subsidiary CPI International Inc. (CPI) announced they have entered into a definitive agreement to acquire the Codan Satcom business from Codan Ltd.