Ampleon announced the availability of the BLCU188XRS, a 1400W, CW capable, high power extremely rugged transistor constructed in a thermally optimized air cavity ACP3 copper flanged plastic package. Able to withstand extremely load mismatches, up to a VSWR > 65:1, this Gen6 HV 50 V LDMOS device has a 30 percent better thermal resistance (R,th) compared to a traditional air cavity ceramic packaged transistor, and combined with its high efficiency, requires less stringent cooling requirements.
RSS
Pasternack, a leading provider of RF, microwave and millimeter wave products, introduces the new PEM009-KIT 60 GHz development system which offers designers the ability to perform product development and experimentation of single and multi-carrier high bandwidth modulation covering 57 to 64 GHz in the globally unlicensed ISM frequency spectrum.
MACOM announced a 300 W GaN on Silicon rugged power transistor in cost effective plastic packaging optimized for use in commercial scale solid-state RF energy applications. Based on MACOM’s Gen4 GaN technology, the new MAGe-102425-300 delivers performance that exceeds LDMOS at an equivalent price profile at scaled volume production levels.
Barry Industries introduces an ultra-broadband, DC to 60 GHz chip termination for microwave applications. The uniquely designed TV0404FA-50R0JN-91 has been third-party tested to show a typical return loss of 18.5 dB or better over a DC to 60 GHz bandwidth.
Collaboration between Ampleon and Midea into the use of solid state technology for compact oven design has resulted in Midea launching what is believed to be the first commercially available solid state RF energy oven.