Software EDA Channel - Press Releases, Events, and Announcements for the EDA Sector

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The fully upgraded EMF Visual software will be a key product for MVG at European Microwave Week in London in the first week of October.

Boonton, a Wireless Telecom Group company, introduced the new RTP4000 series of Real-Time True Average Power sensors. These sensors deliver a dynamic range from -60 to +20 dBm, a frequency range down to 6 kHz and an industry leading measurement rate of 100,000 measurements per second.  Built with Boonton’s Real-Time Power Processing™ technology which eliminates gaps in acquisition and provides zero measurement latency, RTP4000 sensors deliver lightning-fast performance in a compact USB form factor. 

T-Tech Inc. the manufacturer of the Quick Circuit rapid prototyping system announces CNC2PCB^®. The new software application allows you to output your DXF data, Gerber data, or NC Drill data to computer numerical control programs. By following the EIA RS-274 industry standard, the output from CNC2PCB allows you to fabricate your PCB or chassis on your milling center in your mechanical engineering department.

The agenda has been set and registration opened for the sixth annual combined AWR Design Forum (ADF 2016) and NI AWR Software User Group meeting, being held during European Microwave Week (EuMW 2016) October 4-6 in London. ADF 2016 takes place on October 4 from 12:00 p.m. to 4:00 p.m. in ICC Capital Suite, Room 6 on Level 3.

Modelithics Inc. and IPDiA, have teamed up to develop Modelithics models for IPDiA’s high performance ultra broadband surface mount silicon capacitor. Modelithics and IPDiA worked closely as part of the Modelithics Vendor Partner (MVP) Program to characterize the 10 nF low profile (100 µm) capacitor (UBSC 935 152 492 510). 

The organizers of COMSOL Conference 2016 Boston are proud to announce this year’s keynote speakers. The COMSOL Conference is held worldwide in seven major cities. It attracts thousands of engineers and scientists with its focus on multiphysics simulation and application design. The first event is taking place in Boston on October 5-7 and features the following line up of distinguished modeling and simulation professionals.

Tech-X Corp. will exhibit at EDI CON USA 2016 , taking place in Boston, Mass., September 20-22. Stop by Booth #123 to learn about Vsim finite difference time domain (FDTD) electromagnetic (EM) and particle-in-cell (PIC) simulation.  Applications include magnetron sputtering, helix traveling wave tubes (TWTs)  klystrons, gyrotrons, plasma physics and antennas. 

NI AWR Design Environment will be featured in the third annual NI-sponsored RF/Microwave Power Amplifier Forum being held during European Microwave Week (EuMW 2016), October 4-6 in London. Entitled Device Technologies, Characterization, Modeling and End-Use Applications, the forum takes place on Wednesday, October 5 from 9:30 a.m. to 2:00 p.m. in Room 6, Conference Area Level 3.

With the latest release of ANSYS AIM, organizations can accelerate product design through upfront simulation, mitigate late-stage design changes, and reduce the number of costly physical prototypes. Now available, ANSYS AIM 17.2 enhances engineering simulation for thermal management, extends collaboration between designers and analysts, and brings upfront simulation to Japanese engineers in their own language.

The Weightless SIG announced availability of Weightless-P hardware and the pre-launch of a Weightless-P Software Development Kit. In conjunction with Weightless Vendor partner, Antenova, Weightless-P hardware is to be shown at CTIA SuperMobility in Las Vegas, September 7-9. A limited number of free Weightless-P SDKs will be made available to developers in an offer specific to the show.