Software EDA Channel - Press Releases, Events, and Announcements for the EDA Sector

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Sonnet Software Inc. announces a new product, Blink™, which is an easy-to-use EDA environment for the analysis of on chip passive devices such as spiral inductors and MIM capacitors.

A new measurement option for the R&S FSW signal and spectrum analyzer from Rohde & Schwarz allows developers to optimize the EMI performance of their products as early as in the design phase.

To simplify the development of ZigBee® wireless connectivity-enabled smart energy infrastructure, home and building automation and intelligent lighting gateways, Texas Instruments Inc. (TI) announced the availability of the CC2538 system-on-chip (SoC). The industry’s most integrated ZigBee solution, the CC2538 is cost-efficient with an ARM® Cortex™-M3 MCU, memory and hardware accelerators on one piece of silicon.

Agilent Technologies Inc. announced the latest enhancement on its Command Expert software for faster and easier instrument control in many test application development environments.

COMSOL Inc., the leader in multiphysics simulation software, announced the release of major new additions to the COMSOL simulation platform. The latest version of COMSOL Multiphysics, version 4.3b, introduces five new application-specific modules and expanded modeling and analysis tools. Release highlights are available at www.comsol.com/4.3b.

AWR has posted a university success story detailing how Nanjing University of Aeronautics and Astronautics (NUAA) evaluated AWR’s Microwave Office RF and microwave design software as well as its AXIEM EM simulator for university research and education programs.

Intercept Technology Inc., a leader in EDA engineering and layout applications, announces a major new enhancement release of its Pantheon PCB layout software, which includes specialized RF and Hybrid design flows. Following version 7's award-winning debut*, Intercept continues to make great strides forward with its latest version, 7.0_02C.

AWR Corp., the innovation leader in high-frequency EDA software, announced the start of its AWR Design Forum 2013 tour with a diverse schedule of dates and venues in the Asia Pacific region starting this summer. ADF is an open event at which designers of microwave and RF circuits and systems such as MMIC, RF PCB, and LTE can network and share useful information and resources pertinent to high-frequency design, discuss AWR products and technologies, and collaborate on industry issues and trends. Details are available at http://www.awrcorp.com/ADF2013.