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ASE Group , the world's largest provider of independent semiconductor manufacturing services in assembly and test, has placed significant multiple orders with SUSS MicroTec for its lithography production equipment. The first order packages were booked in October and November and included several production mask aligners and coat/bake/develop clusters for...

Saab Systems has signed a contract worth $87 M with Tenix Marine to design and develop the Combat Management System (CMS) for Australia’s new Landing Helicopter Dock amphibious class of ships. The contract will see the company take responsibility for the design, development and integration of the new ships'...

Auriga Measurement Systems LLC announced the hiring of Bruce L. Cohen as president and CEO. Cohen joins Auriga with more than 35 years of industry experience and a proven track record of leading companies to rapid revenue growth and profitability. As one of the founders of Chipcom Corp., an...

Agilent Technologies Inc. today announced its IO Libraries Suite 15.0, which has an improved LAN-discovery interface that simplifies the finding and configuring of LXI and other LAN-capable instruments.

Auriga Measurement Systems, LLC today announced the hiring of Bruce L. Cohen as president and CEO. Mr. Cohen joins Auriga with more than 35 years of industry experience and a proven track record of leading companies to rapid revenue growth and profitability.

Auriga Measurement Systems, LLC today announced the hiring of Bruce L. Cohen as president and CEO.

Rohde & Schwarz Inc. today announced that Rhonda Pierce-Brooks has joined the company as director of human resources.

Rohde & Schwarz today announced the appointment of Christopher A. French as Vice President and General Manager of Rohde & Schwarz Canada, reporting to Jack Cowper, President of Rohde & Schwarz Canada.

The first stone has been laid at the site of STMicroelectronics’ future chip packaging and test facility in Longgang, Guangdong Province, China, in the presence of senior officials of the Shenzhen Municipal government and other dignitaries. The site will consist of up to 40,000 m 2 of manufacturing space,...

The partnership between S.E.T. (formerly the SUSS MicroTec Device Bonder Division) and CEA Leti has resulted in a radically new generation of high accuracy (0.5 μm), high force (4,000 N) device bonder for wafer diameters up to 300 mm. The bonder includes a built-in chamber for collective reflow in...