Semiconductors / Integrated Circuits

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Fujitsu Semiconductor Europe (FSEU) announced the release of MB51T008A, a silicon substrate-based, GaN power device that features a breakdown voltage of 150 V.

Isola Group S.a.r.l., a market leader in laminate materials used to fabricate advanced multi-layer printed circuit boards, has expanded its Suzhou, China manufacturing facility.

Silicon Labs, a leader in high-performance, analog-intensive, mixed-signal ICs, has signed a definitive agreement to acquire Energy Micro AS based in Oslo, Norway, the late-stage privately held company that offers a power-efficient portfolio of 32-bit microcontrollers and is developing multi-protocol wireless RF solutions.

Element Six has acquired the assets and intellectual property of Group4 Labs, Inc., a semiconductor wafer materials company that manufactured GaN on-diamond semiconductor technology for RF and high-power devices.

EnSilica has partnered with Cross Border Technologies to accelerate the sales of both its IC design services and system IP solutions in key European and Asian markets, particularly Germany, France, Japan and Korea.

MEI was at CS Man Tech the week of May 13th to demo the company's high-quality semiconductor and batch immersion process tools that perform. All MEI’s semiconductor equipment are custom tailored to specific semiconductor processes and chemistry.

Cree Inc. will be a first time exhibitor this year in the RF/Microwave Zone at CTIA 2013. The RF Zone, which is organized and managed by Microwave Journal, features approximately twenty RF component and communication IC manufacturers along with test equipment providers. Cree is a world’s leading manufacturer of GaN HEMT devices, which are ideally suited for a host of telecom applications in both macro-base stations and small cells. These devices are perfect for applications seeking to improve bandwidth, efficiency, frequency of operation, or for transmitters challenged to reduce size and weight.

STMicroelectronics announced that its Teseo II single-chip satellite-tracking ICs were successful in the first ground location test using Europe’s Galileo navigation system.

Lime Microsystems has signed a deal with Interlligent RF & MW Solutions to use the company's latest test and measurement technology in the development of its FPRF transceiver ICs.

Renesas Electronics and Renesas Mobile Corp. have announced the availability of a new member of the R-Car Series of automotive Systems-on-Chip (SoCs).