Semiconductors / Integrated Circuits

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Cree Inc. announced the availability of a commercial 1200 V surface-mount SiC Schottky diode. Packaged in an industry-standard surface-mount TO-252 D-Pak, the Schottky diodes deliver the same proven performance as Cree's TO-220 through-hole devices, with a smaller board footprint and lower profile. This can enable the design of smaller,...

As one of the first major global events of the year the 2011 Mobile World Congress was eagerly awaited. Largely perceived as the platform for the mobile communications sector to discuss and evaluate the issues impacting the industry and a vital marketplace for showcasing the latest technological developments, the...

Aviat Networks introduced the Aviat WTM 3000 outdoor networked radio, a new class of product for wireless transmission applications. For the first time in a single radio, the WTM 3000 combines full IP/Ethernet aggregation and switching, along with the latest in advanced radio transmission features to maximize frequency efficiency...

RF Micro Devices Inc. (RFMD) announced availability of the company's RF724x family of HSPA+ power amplifiers. RFMD's RF724x power amplifiers are ultra-high efficiency, single-mode 3G/4G components that reset the bar for performance in smartphones, tablets and other high-performance data-centric connected devices. RFMD's RF724x power amplifiers support ultra-high peak efficiency...

Skyworks Solutions Inc. introduced a new family of antenna switch modules (ASM) for dual- and triple-mode smart phones, tablets and datacards. These newest devices cover a wide range of applications from low-cost 3G handsets to HSPA+/LTE-enabled datacentric devices such as high-end smart phones, data dongles and tablets, all of...

NXP Semiconductors N.V. and security specialist Giesecke & Devrient (G&D) announced the full validation of a joint software solution offering secure interfaces between the handset, NFC functionality and secure elements such as the SIM card. This solution enables NFC to be integrated securely into mobile handsets based on the...

RF Micro Devices Inc. (RFMD) announced that RFMD's PowerSmart™ power platforms and WiFi front-end modules have been selected by LG to enable a broad portfolio of next-generation 3G/4G smartphones, including the LG Optimus 3D — the world's first full 3D smartphone. The LG Optimus 3D was unveiled Monday at...