Semiconductors / Integrated Circuits

Avnera Used Jazz to Deliver Music and Voice Chips

Avnera™ Corp., a fabless semiconductor company specializing in wired-quality wireless audio, used Jazz Semiconductor's® 0.18-micron RFCMOS process (CA18) to develop its semiconductor chip technology for wireless speakers, microphones, headphones and headsets that solves many interference problems. Avnera’s products include the AudioMagic™ chip, which enables uncompressed CD-quality sound for music...
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Haier and NXP Gain EDGE in Chinese Mobile Market

Haier Mobile and NXP Semiconductors have formed a strategic collaboration that commits Haier to adopt NXP's solutions for its EDGE mobile phones. The collaboration aims to fully consolidate the technological and market advantages from both companies, further driving widespread deployment of EDGE technology in the domestic Chinese market. The...
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Freescale Selects SUSS Tool Set for MEMS Facility

SUSS MicroTec, a supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, has shipped and successfully installed several microelectromechanical systems (MEMS) production tools at Freescale Semiconductor. The equipment included a new DSM200 Series Front-to-Back Alignment Verification System, the latest generation SUSS MA200Compact Mask Aligner as...
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Infineon and Delphi to Drive Automotive Development

Infineon Technologies and the automotive system manufacturer, Delphi Corp., are to collaborate closely on developing a new generation of body control units based on the standard AUTomotive Open System Architecture (AUTOSAR). Delphi is to contribute comprehensive systems and software know-how and long-standing experience in the area of body electronics,...
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IEC Announces 2008 DesignVision Award Finalists

The International Engineering Consortium (IEC) honored the finalists of the 2008 DesignVision Awards by giving tribute to the best design tools and products in the semiconductor industry. The IEC's first official announcement of winners will take place at the DesignCon 2008 conference and exhibition this February 4-7 at the...
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Today's Spectrum Management Challenges

Brian DuPell, President of DLI, spoke with Microwave Journal editor David Vye about today’s spectrum management challenges, the RADAR market and the role of High-Q ceramic-based RF/mW components play in achieving the system performance required by today’s military and commercial applications.
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