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Derek considers the standing of III-V processes in the technological landscape, both now and in the future and how higher performance, higher integration and integrated options, together with more stringent requirements, have not only made III-V devices essential today but are ensuring that they will remain so for many years to come
Peregrine's recently announced partnership with IBM leverages the company's high performance devices with a new level of manufacturing capacity as next-generation, silicon-on-sapphire technology will be based on IBM's 180-nm process on 200-mm wafers.
Dr. YC Wang, General Manager of MMIC Business Unit, WIN Semicon- ductor, talks about his company’s success as the world’s leading pure-play GaAs foundry.
Dr. YC Wang talks exclusively to Microwave Journal about his company’s success as the world’s leading pure-play GaAs foundry, his customers’ benefits of being fabless, their process technology roadmap and which growth markets are showing the greatest potential.
Agilent Technologies Inc. and picoChip announced a high-volume manufacturing test solution for 3G femtocell products. The jointly developed solution is based on picoChip’s picoXcell semiconductors and software, and Agilent’s N7310A chipset software. The new integrated manufacturing test solution delivers rapid calibration and verification testing capabilities for original design manufacturers...
RFaxis , a fabless semiconductor company focusing on innovative, next-generation solutions for the wireless and connectivity markets, unveiled its RFX8000 ultra-high efficiency multi-mode/multi-band transmitter integrated circuit (IC) chip for 3G and 4G cellular wireless devices. This RFX8000 chip is based on a new patent pending RF multi-mode/multi-band transmit IC...
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Dr. YC Wang, General Manager of MMIC Business Unit, WIN Semicon- ductor, talks about his company’s success as the world’s leading pure-play GaAs foundry.
Derek Smith, Director of Marketing and Sales at OMMIC, provides a look at today's high performance III-V devices