Semiconductors / Integrated Circuits

AWR Announces Microwave Office Library for Freescale's RF High-power Models

AWR Corp. announced the availability of a Microwave Office® 2010 design software library for Freescale Semiconductor ’s RF high-power models. Freescale’s validated RF high-power models enable power amplifier and base station designers to meet increasing performance demands with a cost-effective and timely solution. Freescale’s RF high-power model library includes...
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Ceragon Acquires Next Generation RFIC Design House

Ceragon Networks Ltd. , a provider of high-capacity, 4G/LTE-Ready wireless backhaul networks, announced that it has acquired all the shares of privately-held Elxys Innovations , Athens, Greece. Elxys is a designer of advanced, next-generation radio-frequency integrated circuits (RFIC). The acquisition solidifies Ceragon's leadership in RF design and allows it...
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Accel-RF's Announces RF Fixture for Characterization of Compound Semiconductor Devices

Accel-RF , a leader in turn-key RF reliability and performance characterization test systems for compound semiconductors, announced the addition of a new 'Smart Fixture' product-line for performance characterization of compound semiconductor devices. This USB controlled fixture, complete with either custom matching circuits, or proprietary wide bandwidth bias-tees, includes an...
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EuMW 2010 Event News

Headlines for Friday, October 1, 2010 M/A-COM Technology Solutions Introduces 38 GHz Packaged Chipset Solution Noise XT Offers Free Software Upgrade Agilent Introduces Next-generation Vector Signal Analysis Software SCHOTT Introduces Scratch Resistent and Shatterproof Glass Headlines for Thursday, September 30, 2010 Agilent 's X-Series Signal Analyzer Options Deliver Measurement...
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WIN and Presto Engineering Announce Strategic Collaboration

WIN Semiconductors Corp. , a pure-play Gallium Arsenide (GaAs) foundry, and Presto Engineering , a semiconductor product engineering company, announced a strategic collaboration to deliver characterization and testing services for companies developing products utilizing GaAs technology from WIN. The agreement covers wafer-level and packaged part development activities, including design...
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