RF & Microwave Industry News

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The new MHF brand I LK Micro RF Coaxial Connector and Wire Harness from I-PEX is designed with a built-in lock that keeps the connector in place on the PCB.

3D Glass Solutions, Inc. (3DGS) is pleased to announce the appointment of Mark Perhacs as director of Sales and Marketing.

At the recent IBC exhibition in Amsterdam, MaxLinear, Inc. demonstrated its proprietary echo cancellation technology for full duplex (FDX) DOCSIS. The combination of FDX and DOCSIS 3.1 will enable cable operators to offer up to 10 Gbps data rates over existing hybrid fiber-coaxial networks.

Keysight Technologies announced the latest release of its SystemVue electronic system level (ESL) software. Offering unique phased array antenna and other 5G functionality, SystemVue 2017 provides designers with the industry’s first 5G design and verification process.

Richardson RFPD, Inc. announced the availability and full design support capabilities for a new 65 V, wideband RF power LDMOS transistor from NXP Semiconductors.

IDT is sampling millimeter wave beamformer ICs developed for 5G phased arrays. The first two products are half duplex transmitter/receiver ICs covering 25 to 31 GHz and 37 to 41 GHz.

Rockwell Collins recently performed a series of demonstrations for prime U.S. Department of Defense contractors and government research laboratories to showcase a new, compact directional communication link that can block out jamming and send signals 10x farther than omnidirectional systems.