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Samsung Electronics unveiled its 28 GHz, end-to-end, fixed wireless access (FWA) equipment for 5G at Mobile World Congress 2018 in Barcelona last week, including the radio access network (RAN) and customer premises equipment (CPE).
Ericsson announces plans to create a series of new innovation hubs serving Middle East and Africa markets following the same global concept of Ericsson Garage.
TMD Technologies Limited (TMD) has announced the acquisition of G2 Engineering Limited, a small, specialist hi-tech microwave design and manufacturing company.
EDI CON China 2018, taking place March 20-22, 2018 at the China National Convention Center in Beijing, announces the finalists in the first EDI CON Innovation Awards.
ZTE Co. Ltd. has reached a milestone by successfully completing the implementation of a DL Cat-18 device. Rohde & Schwarz (R&S) was selected to verify the new ZTE 1.2 Gbps Smartphone with a test setup based on a R&S CMW500 mobile communication tester.
Richardson Electronics Ltd. announced a new distribution agreement with Junkosha USA Inc., a leading manufacturer of high quality, ultra-high performance microwave cable assemblies.
Microchip Technology Inc. and Microsemi Corp. announced that the two companies have signed an agreement for Microchip to acquire Microsemi for $68.78 per share in cash.
Mercury Systems Inc. announced it received a $3.8 million follow-on order from a leading defense prime contractor for state-of-the-art RF subsystems that are integrated into an advanced airborne electronic warfare (EW) system.
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