RF & Microwave Industry News

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China Unicom Beijing and Huawei have jointly completed the world's first commercial adoption of the 5G LampSite 300 MHz digital indoor system at the Beijing Long Distance Call Building. The system supports network sharing between China Unicom Beijing and China Telecom Beijing and provides a downlink perceived rate of up to 3.4 Gbps over a single headend in multi-user scenarios.

Microwave Journal editors Pat Hindle and Gary Lerude cover the March Cable and Connector supplement articles/products, 5G news and Satellite 2020 event in DC.

RFspin has an extremely broadband mmWave antenna with continuous frequency coverage from 6 to 67 GHz and coaxial input and output connectors.

A room-temperature bonding technique for integrating wide bandgap materials such as GaN with thermally conducting materials such as diamond is intended to improve GaN device cooling to achieve higher output power, improved reliability and reduced manufacturing costs.

Rohde & Schwarz and CommSolid have partnered up to demonstrate the effectiveness of the NB-IoT Release 15 feature wake up signal in reducing the power consumption of NB-IoT devices.Test functions newly implemented on an R&S CMW290 Functional Radio Communication Tester are employed to outline the difference in power consumption for NB-IoT devices with and without the wake up signal technology.

ACM Research, Inc. introduced the Ultra SFP ap tool for advanced packaging solutions. The Ultra SFP ap is designed to address yield issues arising from through-silicon via (TSV) processes and fan-out wafer-level packaging (FOWLP), such as copper overburden post-TSV fill and wafer warpage issues that plague FOWLP processes.

Passive Plus Inc. releases quality and a variety of resistors and Thin Film components, both standard and custom designed.