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Akoustis’ acquisition of GDSI is expected to support a strategy to reshore its packaging of XBAW filters to the United States and to support its anticipated application for funding under the CHIPS and Science Act.
Morse Micro announced a partnership with AzureWave Technologies, Inc. where the partnership sees AzureWave design and manufacture two Wi-Fi HaLow modules, including a new 13 x 13 mm module, the smallest in the market.
CES 2023 marks KYOCERA AVX’s first year of participation at this legendary industry event, which will consist of a main exhibition at booth #11123, a co-exhibit at the KYOCERA SLD Laser booth (#7075) and a panel discussion in partnership with the IMC IoT M2M Council.
Akoustis Technologies, Inc. announced that it has completed qualification and released its internally developed proprietary wafer-level-packaging (WLP) technology for the 5G mobile, Wi-Fi, timing control and other markets.
Indium Corporation® has added to its portfolio of pastes for fine feature printing with a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing, as seen with 01005 and 008004 components.
During CES 2023, Ansys will showcase how its comprehensive simulation solutions are accelerating a connected, autonomous, shared and electric future for the mobility industry.
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