RF & Microwave Industry News

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New bandwidths, mixed-signal analysis and options for testing USB interfaces, CAN LIN buses and audio signals: Rohde & Schwarz significantly expanded its oscilloscope portfolio in 2012. At the embedded world 2013 trade fair in Nuremberg (hall 4, booth 112), the company will present its latest applications, two new probes and other state-of-the-art products.

According to Millennium Research Group (MRG), the global authority on medical technology market intelligence, the segment of the United States nonvascular interventional radiology device market with the fastest growth and greatest potential is ablation devices, comprising radiofrequency (RF) ablation, cryoablation and microwave ablation devices. The overall market will grow moderately to $295 million by 2017.

Laird Technologies Inc. has released Android 2.3 Gingerbread support for its Summit 40 Series radio modules, which support dual-band 802.11n (802.11a/b/g/n) and Bluetooth 2.1.  

Stackpole's RAVN Series is a thin film based chip array designed for applications with tight tolerance or tight TCR requirements. The Series offers four resistive elements in a 1.6 x 3.2 mm package with resistance values from 100 Ω up to 33 K Ω in a 0.1 percent tolerance. 

Tektronix Inc., a leading innovator of signal generation and analysis solutions required for the microwave and RF industry, today announced the H500 and SA2500 Handheld Spectrum Analyzers that include DPX™ waveform image processor technology to provide a live RF view of the spectrum. With unique DPX technology along with built-in mapping and signal classification features in a compact, ruggedized package, the instruments are designed to allow spectrum regulators to efficiently manage and monitor spectrum in the field and hunt down elusive signals and interferers.

EAM's low loss cable assemblies provide the highest level of electrical performance for applications requiring extremely low attenuation over a broad frequency range. By combining silver-plated copper center conductor, expanded PTFE tape dielectric, aluminum polyester or polymide tape, silver-plated copper outer braid, and FEP jacket, these low loss cable assemblies achieve outstanding electrical characteristics to 18 GHz.

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials, will exhibit at the upcoming DesignCon 2013 conference and exhibition, January 29-30, 2013 at the Santa Clara Convention Center in Santa Clara, California. DesignCon is one of the Printed Circuit Board (PCB) industry’s premier events to learn about the latest advanced products, technologies and developments in the market.

A line of modular, highly reliable, solid-state systems for upgrading virtually all military and commercial radar transmitters with vacuum electron devices (VEDs) is available from Diversified Technologies Inc. of Bedford, MA.

Kaelus, a Smiths Interconnect business announced that as a result of best practice industry research, Frost & Sullivan has recognized Kaelus with the 2012 Global Market Share Leadership Award in Passive Intermodulation Test Equipment for capturing the highest market share within its industry.

The Wireless Gigabit (WiGig) Alliance, which formally contributed to the IEEE 802.11ad standard process, has heralded its publication as a critical moment in bringing a global wireless ecosystem of interoperable, high performance devices that work together seamlessly.