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Pentek Inc. announced an enhancement to its fastest-ever data acquisition XMC module for the popular Cobalt® family. The Model 71641, capable of digitizing one 12-bit channel at 3.6 GHz, or two channels at 1.8 GHz, comes preconfigured with a programmable one- or two-channel digital downconverter (DDC) loaded into the onboard Xilinx Virtex-6 FPGA. The new module is ideal for wideband radar and software defined radio (SDR) applications.
AWR Corp. has announced AWR Design Environment V10.04, its first new software release in 2013, which includes many new features and enhancements to Microwave Office/Analog Office and Visual System Simulator, as well as AXIEM and Analyst.
Texas Instruments Inc. (TI) introduced a wideband frequency synthesizer with integrated voltage-controlled oscillator (VCO) that delivers the industry’s lowest phase noise. Its combination of ultra-low noise phase-locked loop (PLL) and industry’s highest phase detector frequency outperforms the competition in both phase noise and spurs.
An official ceremony was held at Finnish Air Force headquarters in Tikkakoski to mark ThalesRaytheonSystems' delivery of a Ground Master 400 (GM 400) long-range air defense radar system.
Teseq has designed a new coupling/decoupling network (CDN) for surge testing on unshielded symmetrical high speed telecommunication lines including Ethernet.
Following the completion of a £700,000 funding round to expand its overseas sales and device characterization capabilities, Mesuro has announced the enhanced services and capabilities it is now able to offer its customers
NEC Corp. announced the deployment of its iPASOLINK microwave mobile backhaul series for NURTS Bulgaria JSC, one of the leading broadcasting companies in Bulgaria.
CEA-Leti and Agilent Technologies will present their recent research results in the field of embedded integrated systems at the IEEE Silicon Monolithic Integrated Circuits in RF Systems (SiRF) Conference in Austin, TX, Jan. 21-23.
Ohmega Technologies has introduced OhmegaPly® MTR™ Technology, which allows thin film resistors to be built within a printed circuit trace that is less than 100 microns (0.004”) wide. Using standard subtractive printed circuit board processes, it is ideal for high density interconnect (HDI) designs where passive component placement is difficult or impossible.
DesignCon 2013, which will take place January 28-31 in Santa Clara, CA, will feature three visionary keynotes, two live teardowns conducted by the hardware repair wizards of iFixit and more than 120 in-depth tutorials, technical paper sessions, training sessions and panel discussions all customized for the chip, board and systems design communities.
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AWR Corp. has announced AWR Design Environment V10.04, its first new software release in 2013, which includes many new features and enhancements to Microwave Office/Analog Office and Visual System Simulator, as well as AXIEM and Analyst.
An official ceremony was held at Finnish Air Force headquarters in Tikkakoski to mark ThalesRaytheonSystems' delivery of a Ground Master 400 (GM 400) long-range air defense radar system.