RF & Microwave Industry News

Richardson Electronics at IMS2016

Disruptive technologies and products featured in the “Think Tank” at Booth #2350

Richardson Electronics Ltd. announces its participation at the 2016 IEEE International Microwave Symposium (IMS2016). IMS2016, organized by the IEEE Microwave Theory and Technique Society (MTT-S), is the premier conference for attendees to learn about the latest information in the RF and microwave industry.


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Laser Services to exhibit at IMS2016

Laser Services, an ISO 9001:2008 - AS9100C and ITAR registered laser job shop, will be exhibiting at the 2016 International Microwave Symposium (IMS) in San Francisco, Calif., being held from May 22–27, in booth #1853. They will be discussing their services and techniques for RF and microwave applications.


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Ardent Concepts releases industry's highest bandwidth multicoax connector

Ardent Concepts Inc., a leading designer and manufacturer of high performance GHz connectors used in the development of next generation semiconductor applications and systems has again pushed bandwidth barriers with a 70 GHz configuration of its innovative TR Multicoax series connectors. TR 70 realizes Ardent’s mission to bring tomorrows connector solutions to market today. With exceptionally low loss, TR 70 ensures quicker, more accurate, and more repeatable functional test of cutting-edge IC applications.


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IoT to account for 28 percent of wireless connectivity IC market by 2021

ABI Research, the leader in transformative technology innovation market intelligence, finds that smart home, beacon, wearable, and other nascent IoT applications including energy management and smart cities are to propel the wireless IoT connectivity market forward. The market’s trend toward multi-protocol connectivity IC adoption will ease development time, boost scale, and reduce complexity and cost for manufacturers across these different sectors in the years ahead.


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UTAC and AT&S collaborate on turnkey supply for 3D SiP solutions

UTAC Holdings Ltd. (UTAC), one of the leading semiconductor assembly and test services provider in Asia, announced a joint collaboration with AT&S, one of the global leading manufacturers of high-end printed circuit boards (PCBs) with headquarters in Leoben, Austria, to provide complete turnkey supply chain solutions for three-dimensional system-in-package (“3D SiP”) requirements.


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Pasternack expands portfolio of in-stock PIN diode switches

Pasternack, a leading provider of RF, microwave and millimeter wave products, greatly expands their portfolio of in-stock solid state PIN diode switches covering frequencies from 10 MHz to 67 GHz. 69 unique new models of 50 ohm PIN diode switches are available in compact connectorized package styles and display impressive isolation, insertion loss, and switching speed performance.


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