RF & Microwave Industry News

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W. L. Gore & Associates introduced an online tool designed to complement the existing GORE™ Microwave/RF Assembly Builder. The new GORE™ Microwave/RF Assembly Calculator is used to calculate insertion loss, VSWR and other parameters of GORE® Microwave/RF Assemblies for different cable types. The calculator is particularly useful when the initial cable type is unknown and needs to be specified independent of the connector.

EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, has announced the participants in this year’s Technical Advisory Committee.

HUBER+SUHNER, is debuting its Quick-Fit plus connector system for ½” corrugated cables used in Distributed Antenna Systems, at SCWS World 2016 in London.

The NNB 21 line impedance stabilization network from Langer EMV-Technk GmbH is designed for measuring grid bound interference of a device under test, in accordance with the CISPR 25/ISO 7637 standard.

Keysight Technologies Inc. announced it will demonstrate the latest design, simulation and test solutions for wireless communications and aerospace & defense at the IEEE MTT-S International Microwave Symposium (IMS2016), Booth 1239, San Francisco, Calif., May 24-26.

Mentor Graphics Corp. announced a comprehensive product-creation platform based on PADS® PCB software that enables individual engineers and small teams to solve the engineering challenges involved in creating today’s electronic products.

Tim Dolan, longtime vice president of engineering at K&L Microwave in Salisbury, Maryland, passed on April 15, 2016, after several weeks of illness. Tim is survived by his wife Diane, daughter Elizabeth, sons Tommy and Jeffrey, daughter-in-law Jillian, close relatives including three siblings and numerous cousins, and many grieving coworkers and business associates.

MACOM Technology Solutions Inc. (MACOM) will showcase its industry leading GaN on Silicon portfolio and other high-performance products at IEEE’s International Microwave Symposium (IMS) 2016 in San Francisco, Calif., May 24 - 26. MACOM’s booth will feature new product solutions optimized for commercial, industrial, scientific and medical RF applications.

Nokia and Ooredoo Qatar have signed a three-year agreement under which Nokia will upgrade and expand Ooredoo's existing mobile broadband network across the country.

e2v has won a contract with Airbus DS GmbH to design, develop and supply bespoke CMOS image sensors for advanced METimage radiometers for MetOp weather satellites.