RF & Microwave Industry News

EDI CON USA Announces Amplifier Design Content

EDI CON USA 2016,  a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, announces its RF Amplifier Design track for this year’s conference and exhibition. The exhibition will host more than 138 exhibiting companies from the RF, microwave, and high-speed digital industries, including demonstration pods in the Signal Integrity Zone. Some RF/Microwave Amplifier Design highlights include...


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Nano Dimension delivers world's first 3D printer for multilayer PCBs

Nano Dimension Ltd., a leader in the field of 3D Printed Electronics, announced that its wholly owned subsidiary, Nano Dimension Technologies, has supplied the first DragonFly 2020 system designated for 3D circuitry and PCBs. The supply was made to a leading defense company in Israel for evaluation purposes and is expected to be installed at the partner’s site in the coming days.


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