RF & Microwave Industry News

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Dassault Systèmes, the 3DEXPERIENCE Company, world leader in 3D design software, 3D Digital Mock Up and Product Lifecycle Management (PLM) solutions, announced it has entered into a definitive agreement to acquire CST - Computer Simulation Technology AG, the technology leader in electromagnetic (EM) and electronics simulation, for approximately 220 million euros.

TE Connectivity (TE), a world leader in connectivity and sensors, announces its new Ruggedized Optical Backplane interconnect systems that provide a high-density, blind-mate optical interconnect in a backplane/daughtercard configuration. The half-sized connectors are fully compliant to the ANSI/VITA 66.4 standard.

Mitsubishi Electric has developed a 25 Gbps distributed feedback (DFB) laser diode for next-generation optical links connecting base stations and central offices in radio access networks.

Rogers Corp. introduces RO4730G3™ UL 94 V-0 antenna-grade laminates to meet present and future performance requirements in active antenna arrays and small cells, notably in 4G base transceiver stations (BTS) and Internet of Things (IoT) applications as well as emerging 5G wireless systems.

Keysight Technologies Inc. announced the newest release of its high-performance, Advanced Low-Frequency Noise Analyzer (A-LFNA), which is designed to make fast, accurate and repeatable low-frequency noise measurements. The release features a new user interface and tight integration with Keysight’s WaferPro Express software—a platform that performs automated wafer-level measurements of semiconductor devices.

Integrated Device Technology Inc. (IDT) introduced a highly flexible 12-output clock generator featuring ultra-low jitter performance to meet the demanding requirements of the communications and datacom markets.

Integra Technologies Inc. (ITI), a leading designer and manufacturer of high-power RF transistors, pallets and amplifiers, announced the completion of a 1 kW GaN high efficiency amplifier, IGNP0450M1000, for aerospace radar applications, funded by NASA/JPL through SBIR Phase I and II grant awards. 

Qorvo^®, a leading provider of innovative RF solutions that connect the world, announced that its infrastructure solutions have supported more than twenty 5G field trials with global infrastructure providers. This is a key milestone in Qorvo's strategy to support the evolving 5G ecosystem and help accelerate the deployment of 5G.

EDI CON USA 2016 announces it sold-out its show floor, with a total of 138 exhibiting companies from the RF, microwave, and high-speed digital industries. As a result, the show management has issued a second floor expansion. There is also limited availability for a demo pod in the Signal Integrity Zone.

Intelliconnect (Europe) Ltd now offers its Pisces waterproof connector range manufactured in nickel aluminum bronze, which does not require plating for environmental protection.