RF & Microwave Industry News

Wolfspeed releases highest power L-Band radar GaN HEMT

Wolfspeed, A Cree Company and a leading global supplier of GaN-on-SiC high electron mobility transistors (HEMTs) and monolithic microwave integrated circuits (MMICs) with best-in-class reliability, will release the highest power 50V GaN HEMT demonstrated to date — its 900W CGHV14800 GaN HEMT for L-Band radar applications — to market at European Microwave Week 2016, which will take place in London, October 3–7.


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NI AWR software showcased at multiple events during EuMW 2016 

NI AWR Design Environment will be showcased at multiple events during European Microwave Week 2016 (EuMW 2016), from October 4-6 in London. NI AWR software demonstrations on display in Booth #4 include the latest applications featuring load pull, radar systems, antenna design, AWR Connected™ third-party integration flows and the newest product in the NI AWR design software portfolio, AntSyn™ , a cloud-based software as a service (SaaS) for antenna synthesis and optimization solution. Booth visitors will also be treated to a special sneak peek of select new features in the upcoming V13 release.


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Horizon House Publications launches industry’s first Signal Integrity Journal

Horizon House Publications announces the launch of Signal Integrity Journal, a sister publication to Microwave Journal, covering signal integrity, power integrity and EMC/EMI related topics. Signal Integrity Journal will be the first peer reviewed, industry journal to cover these markets. Signal Integrity Journal is initially launching as a website, www.signalintegrityjournal.com, and plans to start publication of the periodical journal in 2017. The website is now available as a beta version with content being added quickly for full release shortly.


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Ardent aims to eliminate surface-mount connectors with new QUICKLINK coaxial connector

Ardent Concept's patented QUICKLINK™Connector mounts directly to the PCB with a twist-to-lock footprint design that requires only two small thru holes and a gold pad for the connector to land on. QUICKLINK™ footprints can be placed anywhere on your board to allow easy access to any channels from your device without having to solder on costly SMA or SMP surface mount receptacles.


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