RF & Microwave Industry News

TE Conn

Richardson RFPD Introduces New Board Level Shields from TE Connectivity

Richardson RFPD  announced the availability and full design support for a new portfolio of board level shields from TE Connectivity. These new board level shields are stamped one- and two-piece metal cages that help provide isolation of board-level components, minimize crosstalk and reduce EMI susceptibility without impacting system speed.


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Tek THz

Tektronix, IEMN Demonstrate 100 Gb/s Wireless Transmissions Using New IEEE 802.15.3d Standard

Demonstration Uses a Single Carrier Wireless Link in the 300 GHz Band to Achieve 100 Gb/s Data Rate

Tektronix, Inc. and IEMN, a major French research laboratory, demonstrated a single carrier wireless link traveling at a 100 Gb/s data rate. This demonstration uses advanced data coding, THz photonics and wideband and linear devices to enable ultra fast wireless connections in the 252 - 325 GHz band per the recently published IEEE 802.15.3d standard.


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