RF & Microwave Industry News

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Ansys announced a collaboration with NVIDIA to develop next-generation simulation solutions powered by accelerated computing and generative AI.

The Telecom Infra Project (TIP) celebrated the achievements of the Open AFC Software Group, following the FCC approval of three operators — Broadcom, Wi-Fi Alliance Services and the Wireless Broadband Alliance — using the Open AFC software solution.

Pixus Technologies now offers a Tier 3 SOSA aligned chassis management module for OpenVPX that is pluggable.

Global MilSatCom announced its 2024 conference, scheduled to take place from 4-7 November at the QE II Centre, London. 

Raytheon was awarded a $1.2 billion contract to supply Germany with Patriot® air and missile defense systems. 

Yole Group projects that in 2024, semiconductor device revenue for mobile and consumer is expected to have a 4 percent year-on-year rebound, according to its new technology and market analysis, “Semiconductor Trends in Mobile and Consumer 2024.” 

Passive Plus offers custom capacitor assemblies for high power requirements. 

mmTron announced its first single-chip front-end IC for mmWave communications, the TMC252 , covering 24 to 30 GHz.

MAPCON invites authors to submit their original research work in form of technical papers starting April 15 and due by July 1.