RF & Microwave Industry News

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PRODUCT FEATURES A Low Loss LTCC System for Wireless Applications Heraeus Inc. W. Conshohocken, PA A new low temperature co-fired ceramic (LTCC) material system has been developed to address emerging new communications market demands such as wireless telephones, automotive components and Bluetooth modules. Unlike other materials for microwave applications,...

PRODUCT FEATURES A Voltage Variable Attenuator Using Silicon PIN Diodes and a Passive GaAs MMIC in a Plastic SMT Package RF& MW Components Group, M/A-COM Inc. Lowell, MA A unique voltage variable attenuator (VVA) has been developed for the commercial wireless market. The device has linear operating power and...

TECHNICAL NOTES A Simple Gain Equalizer for a PCS-band Amplifier Barney Arntz Philips Semiconductors Mansfield, MA A simple distributed network is described, which has the effect of flattening the frequency response of an amplifier or system by reducing its gain in a particular frequency range. Operating with a quarter-wave...

TECHNICAL FEATURES Improving Accuracy and Reliability of Microwave On-wafer Silicon Device Measurements Troels Emil Kolding Aalborg University, RISC Group Denmark Aalborg, Denmark This article summarizes recent research findings and general guidelines for microwave on-wafer measurement of devices fabricated using silicon technologies. Issues specific to low resistivity substrates and low...

TECHNICAL FEATURES Extending Gold Thick-film Technology through Materials and Process Development Meg Tredinnick and David Malanga Heraeus Inc., Circuit Materials Division West Conshohocken, PA New powder and screen technologies have allowed for the development of a thick-film gold paste that meets a difficult list of requirements. This new Au...

TECHNICAL FEATURES Time Domain Analysis of a Printed Circuit Board Via Brock J. LaMeres Agilent Technologies Colorado Springs, CO T.S. Kalkur University of Colorado, Department of Electrical and Computer Engineering Colorado Springs, CO This article describes the time domain analysis of a printed circuit board via connecting two semi-infinitely-long...

TECHNICAL FEATURES Finite Element Analysis of RF Couplers With Sliced Coaxial Cable N. Benahmed and M. Feham University of Tlemcen, Department of Electronic Tlemcen, Algeria This article presents the analysis of two coupled lines with sliced coaxial cable, based on a numerical resolution of the Laplace's equation by the...

TECHNICAL FEATURES A Dynamic Drain Current Model for MESFET/HEMTs Valid Under Varying Static Bias and Temperature Conditions J.M. Cairon, A. Tazon, T. Fernandez, C. Navarro and A. Mediavilla University of Cantabria Cantabria, Spain J. Rodriguez-Tellez University of Bradford West Yorkshire, UK Modifications to the Dortu-Muller DC drain current model...

TECHNICAL FEATURES Design Considerations for Thick-film High Power Chip Terminations Robert Grossbach American Technical Ceramics Huntington Station, NY A s the wireless revolution extends component requirements upward in frequency, higher in operating power and smaller in size, the performance demands on surface-mount devices grow ever more stringent. Chip terminations...

TECHNICAL NOTES Shielding Formulas for Near Fields R.C. Hansen Consulting Engineer Tarzana, CA This article reviews extremely low frequency (ELF) formulas for magnetic shielding effectiveness. In particular, the simple three-term Schelkunoff formula is accurate at all frequencies if the proper near-field, or far-field, wave impedance is used. E lectromagnetic...