RF & Microwave Industry News

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Anritsu Co. introduces a Bluetooth low energy testing option that allows designers and manufacturers of Bluetooth products to conduct radio layer testing that is in compliance with the newly adopted Bluetooth Core Specification 4.0. With the option, engineers can use the MT8852B to complete a test script covering Bluetooth...

Giga-tronics Inc. announced that it has received three orders valued at $5.1 M for microwave components from a major aircraft manufacturer. The award for high performance specialty filters based upon the company’s fast switching YIG technology will be fulfilled by Giga-tronics’ Microsource component subsidiary located in Santa Rosa, CA....

Murata Electronics North America introduced the new LQH88P_38 series of power inductors, marking Murata's entrance into the large form factor power inductor market. The inductors support up to an 8A rated current and measure 8 x 8 mm with a low profile of 3.8 mm. This new inductor series...

Agilent Technologies Inc. announced an LTE test solution that combines the market-leading Agilent 89600 VSA LTE FDD and LTE TDD analysis software with the highest-performance member of the Agilent X-Series, the Agilent N9030A PXA signal analyzer. The PXA provides industry-leading RF performance that supports both LTE FDD and LTE...

Herley Industries Inc. announced a recent award to EW Simulation Technology ("EWsT"), the company's subsidiary in Farnborough UK. Richard F. Poirier, Herley's Chief Executive Officer and President, commented, "EWsT has recently received an order for approximately US$1.5 M for a RSS8000 radar threat simulator from the defense and security...

Comtech Telecommunications Corp. announced that its Melville, New York-based subsidiary, Comtech PST Corp. , received a $2.5 M contract from a major domestic OEM to supply high-power amplifiers. These amplifiers are key components in a complex Identification Friend or Foe (IFF) system used to interrogate aircraft to determine their...

Epic Communications Inc. (Epicom) announced that it has released the industrial smallest form factor and most complete flip-chip based RF Front-End Integrated Circuit (FEIC) with copper pillar solder bumps. FM2491_FC is Epicom’s first single chip FEIC product portfolio based on flip-chip configuration, designed for smart-phone and mobile internet device...

Peregrine Semiconductor Corp. , a supplier of high-performance RF CMOS and mixed-signal communications ICs, announced the first pair in a series of new SPDT RF switches addressing the needs of wireless infrastructure, 2.4 GHz Industrial, Scientific and Medical (ISM), and broadband applications for fiber optics and Multichannel Multipoint Distribution...

AWR , an innovation leader in high-frequency electronic design automation (EDA), announced Version 2009 of its Analog Office high-frequency analog and RFIC design software. This latest release includes AWR’s patent-pending multi-rate harmonic balance (MRHB™) technology, which dramatically increases the speed and reduces the computer memory required to perform steady-state...

Every year, ABI Research conducts a comprehensive survey of companies currently using, deploying, or piloting/evaluating RFID. This year more than 115 qualified organizations from across the world responded to ABI Research’s annual RFID end-user survey. Nearly half (49 percent) of those respondents currently using, deploying, evaluating, or piloting RFID...