RF & Microwave Industry News

European Project on Integrated Electronic System-in-Package Solutions

The largest research project in Europe to research and develop highly integrated electronic system-in-package solutions has been launched. Working together on the Efficient Silicon Multi-Chip System-in-Package Integration (ESiP) project are 40 microelectronics companies and research institutions from a total of nine European countries, with the aim of making miniaturized...
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Skyworks Maintains PA Share Lead

Exploring changes in the handset and cellular device power amplifier (PA) market brought about by the economic slowdown and contraction in cellphone shipments, Strategy Analytics released, "Skyworks Maintains Power Amp Share Lead," from the Strategy Analytics RF & Wireless Component market research service. This report analyzes the effect these...
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Around the Circuit

Harry Sidney Rutstein passed away on July 24, 2010. He lived in several cities, on both coasts, and explored hundreds of countries over his 80 years. Rutstein served in the army during the Korean War where he worked in Intelligence. Rutstein was a modern day Marco Polo and is...
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Exposure

At the Journal , we seem to be experiencing an uptick in submitted articles from industry. Whether this reflects a wave of pent-up technology advances and product releases or a collective recognition that companies need to connect with their potential customers, I see it as a sign that companies...
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Rogers to Highlight Bisco Silicon Products

The High Performance Foams Division of Rogers Corp. will be exhibiting at this year’s InnoTrans (Hall 3.1, 101), 21-24 September, in Berlin, Germany. Rogers will be showing its BISCO® MF-1™ seating materials and its BISCO L3 foams for use in railway flooring systems. Rogers BISCO MF-1 materials, used in...
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