RF & Microwave Industry News

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Harris Corp., an international communications and information technology company, has been awarded an indefinite delivery, indefinite quantity (IDIQ) contract with a potential total value of $475 M to supply military and land mobile radio systems to international partners of the US State Department and US Department of Defense. The...

A group of 17 leading European telecommunications service providers, IT corporations, infrastructure vendors and academic institutions have launched UniverSelf, a research initiative whose goal is to overcome the increasing complexity of managing communication networks and enable their future growth by generating innovations in autonomic networking—technologies that enable networks to...

e2v and the University of Nottingham, UK, have formed a new partnership in the area of microwave semiconductor devices, which aims to drive forward the research and manufacturing of cutting-edge electronics. The aim of the collaboration is to develop and manufacture advanced semiconductor devices for use in microwave and...

Six partners from the semiconductor and solar industries are joining forces in the NEULAND project funded by the Federal Ministry of Education and Research (BMBF), Germany, to explore new avenues for the efficient use of electricity from renewable sources. NEULAND stands for innovative power devices with high energy efficiency...

Jean-Jacques Dordain, Director General of the European Space Agency (ESA), and Steve MacLean, President of the Canadian Space Agency, signed a new Cooperation Agreement that will extend the partnership between ESA and Canada until 2020.The two space agencies have enjoyed a 30-year partnership that has led to many successful...

When it comes to mobile network infrastructure discussions, LTE is the name on everyone's lips. Yet the very meaning of the acronym—"Long-Term Evolution"—is a hint that it is not going to happen overnight. LTE's deployment as the mainstay 4G technology will take place gradually, and will not even begin...

Innovative Micro Technology announced the addition of a new geometry point in its technology roadmap for Through Silicon Vias (TSV). Joining the copper-filled 15 by 60 micron depth TSV configuration that has been in production for nearly two years, IMT has been sampling its 50 by 250 micron copper-filled...

Rapid Chinese TD-SCDMA rollouts and the often-maligned GSM/GPRS/EDGE equipment markets have benefited the base station RF power amplifier and RF power device markets. GSM/GPRS/EDGE RFPAs and devices are still shipping in the millions. The Asia-Pacific region is presently accounting for more than 50 percent of the RF power semiconductor...

The worldwide market for digital set-top boxes—including hard-to-track free-to-air satellite (DBS) boxes—will grow from 205 million in 2010 to 226 million in 2015. Shipments in North America and Western Europe are falling following largely successful digital transitions, while Asia-Pacific, Latin-America and Eastern Europe all see significant growth. Set-top boxes...

In Memory of... Microwave Journal's co-founder and first editor, Ted Saad passed away January 25th, 2011. In addition to putting his stamp on this magazine, Saad had a long and influential career that touched many in the industry and microwave technical society. Saad worked at MIT Radlab between 1942...