RF & Microwave Industry News

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Cadence Design Systems, Inc. and Samsung Electronics have collaborated to deliver a 20 nanometer design methodology that incorporates double patterning technology for joint customer deployment and internal test chips. The collaboration brings new process advances for mobile consumer electronics, enabling design at 20 nm and future process nodes.

According to Ericsson, 85 percent of the world's population will have internet coverage via 3G by 2017 and there will be close to nine billion mobile subscriptions, compared to six billion by the end of 2011.

Providence-based marketing communications agency Sheppard Leger Nowak Inc. (SLN) is teaming up with Transline Technology Inc. (TTI) of Anaheim, CA at the 2012 IEEE International Symposium coming up in Montreal, Canada on June 19-21 for a three-day series of fun challenges that will have lucky winners taking home some very cool electronic equipment prizes.

EMC Technology has introduced another cost effective solution for temperature compensation in an SMT planar style, the AN11 series. This ultra mini Thermopad® offers the smallest 0402 package size for temperature variable attenuators in the industry. The AN11 series is perfect for hand held devices and instruments, pico base stations and more. With excellent frequency response from DC to 6 GHz the AN11 series handles 100mW of input power, requires no bias or control voltages and generates zero distortion.

Plextek (www.plextek.com), a leading designer of custom ICs operating at microwave and mm-wave frequencies, will be presenting details of a low cost, SMT packaged, 6 to 18GHz, 0.5W amplifier integrated circuit (IC) at the International Microwave Symposium, the world’s largest microwave conference and exhibition.

Researchers at MIT have found a new way of making complex three-dimensional structures using self-assembling polymer materials that form tiny wires and junctions. The work has the potential to usher in a new generation of microchips and other devices made up of submicroscopic features.

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.

Harris Corp. has been awarded a two-year, $19 million contract by the U.S. Department of Veterans Affairs Office of Information and Technology to create a wireless network infrastructure for medical centers nationwide.

Aviat Networks Inc., a leading expert in microwave networking solutions, announced that it has joined the Next Generation Mobile Networks (NGMN) Alliance as an active sponsor along with a community of leading operators and manufacturers in the mobile industry. The company will also be showcasing its latest LTE proven products at the NGMN Industry Conference, which will be held June 13-15, in San Francisco, California.

A new technology platform from leading design and development firm Cambridge Consultants is enabling wireless devices such as radio microphones and intercoms to deliver high-quality audio within international license-free radio bands – even in mega-stadiums. It means Digital Enhanced Cordless Telecommunications (DECT) can now provide the same range in a large arena as it does in open spaces – typically more than 100 meters – without the problem of interference when there is a high concentration of devices.