RF & Microwave Industry News

Agilent's Bluetooth RF test solution speeds development of devices based on TI ICs

Agilent Technologies Inc. announced its Bluetooth low-energy test solution on the N4010A wireless connectivity test set was verified by Texas Instruments Inc. for use with TI’s integrated circuits in Bluetooth Smart and Smart-Ready devices. The Bluetooth low-energy Tx/Rx test capability on N4010A gives manufacturers and design houses reliable and efficient test solutions for single-mode and dual-mode devices.


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ANADIGICS appoints new VP, Infrastructure Products and CTO

ANADIGICS, Inc. announced that Tim Laverick has joined the company as vice president, infrastructure products, and Robert Bayruns has been appointed vice president and chief technology officer. Laverick is a business and engineering leader with over 20 years of experience in the RF and Microwave semiconductor industry and Bayruns has over 30 years of leadership and engineering experience. 


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ANSYS signs definitive agreement to acquire Esterel Technologies

ANSYS Inc., a global innovator of simulation, and Esterel Technologies S.A. ("Esterel") a leading provider of embedded software simulation solutions for mission critical applications, announced that they signed a definitive agreement whereby ANSYS will acquire Esterel Technologies for a cash purchase price of approximately euro 42 million (or approximately US$53 million), subject to certain working capital adjustments at close.


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Standalone vs. integrated dilemma is major theme of $37B mobile handset semiconductor market

Revenues for core semiconductor components used in mobile handsets, including platform ICs and wireless connectivity ICs, are expected to reach almost $37 billion per annum in 2012. The market has seen strong growth from 2009 as the smartphone market has increased significantly, driving growth for many components, including applications processors and Wi-Fi ICs.

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