RF & Microwave Industry News

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Agilent Technologies Inc. will feature the PXI-based TS-8900 Automotive Functional Test System at the Automotive Testing Expo (Booth 12024), Oct. 23-25, at the Suburban Collection Showplace in Novi, Mich.

Wireline operators have been the largest market for IMS services to date, but due to an increase in the number of mobile IMS deployments, ABI Research forecasts IMS revenues to reach $3.4 billion in the next five years.

Murata Manufacturing Company Ltd. is continuing its advancement toward globalization. Expansion of manufacturing capacity outside Japan will continue in 2013. Recent acquisitions of RFM and VTI offer significant customer benefits, such as enhanced product development and manufacturing capabilities, expertise in new markets and access to the Murata global supply chain.

Wireless infrastructure equipment revenues continued their downward trend in the second quarter of 2012 reaching only $11.2 billion – a 4.7 percent decrease from the first quarter of 2012 and a 14 percent decrease from the same quarter one year ago. “Total revenues for wireless network equipment reported by the vendors was the lowest amount that we have seen since 3Q 2003; reaching a 35 quarter low,” says Nick Marshall, principal analyst, networks.

Families in Northeastern Connecticut are gearing up for a fun day of activities to help combat hunger by attending the first annual Harvest for Hunger event, Sunday, October 14, at Fort Hill Farms in Thompson, CT. Sponsored by the employees of Rogers Corp. and Fort Hill Farms, the event will be held from 11 a.m. to 5 p.m. A variety of fund-raising activities at the event will benefit Connecticut Food Bank’s mobile pantry and food programs of Thompson Ecumenical Empowerment Group (TEEG).

Aethercomm Inc., has recently completed a high power SSPA using a Gallium Nitride (GaN) with a frequency range covering 2.9 to 3.1 GHz: Aethercomm part number SSPA 2.9-3.1-300. The devices in this amplifier design are not matched, therefore the frequency band is scalable from 2.7 to 2.9 GHz or 2.7 to 3.5 GHz with similar performance. This high power SSPA produces 300 to 400 watts peak output power.

Linear Technology’s Dust Networks® product group introduces the SmartMesh™ LTC5800 (system-on-chip) and LTP5900 (module) families, the industry’s lowest power IEEE 802.15.4E compliant wireless sensor networking products. SmartMesh ICs and modules enable tiny sensor “motes” to be designed with a battery life of over 10 years, while companion network manager components enable the development of highly robust and secure wireless sensor networks (WSN).

COMSOL introduces Version 4.3a of COMSOL Multiphysics®, its flagship software for modeling and simulating physics-based systems. With version 4.3a, COMSOL introduces LiveLink™ forExcel® to connect multiphysics results with spreadsheets.

Agilent Technologies Inc. announced 14 FieldFox handheld analyzers that deliver benchtop-instrument accuracy in field-test environments. Designed for harsh conditions and hard-to-reach locations, FieldFox analyzers cover satellite communications, microwave backhaul, military communications, radar systems and a wide range of additional applications.

Freescale Semiconductor announced new two-stage, low-noise amplifiers (LNAs) that address two gain stages in one device and deliver coverage across multiple bands to simplify wireless base station designs.