RF & Microwave Industry News

Silicon Labs acquires Energy Micro

Silicon Labs, a leader in high-performance, analog-intensive, mixed-signal ICs, has signed a definitive agreement to acquire Energy Micro AS based in Oslo, Norway, the late-stage privately held company that offers a power-efficient portfolio of 32-bit microcontrollers and is developing multi-protocol wireless RF solutions.


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Hesse Mechatronics debuts dual-head wedge bonder in the Americas

Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders and ribbon bonders for the backend semiconductor industry, announces that it will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.


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