RF & Microwave Industry News

RSS

Texas Instruments Inc. (TI) introduced the industry’s fastest 4-channel, 14-bit analog-to-digital converter (ADC), clocking in at 250 MSPS. The high-density ADS4449 enables receiver systems to support up to 125 MHz of instantaneous bandwidth in extremely small forms, such as multiple input and multiple output (MIMO) base stations and munitions guidance, or in greater density applications, such as active electrically scanned array (AESA) and other phased-array radars.

Analog Devices Inc. (ADI) introduced four new RF amplifier gain blocks which ease the design of high dynamic range communications, defense and instrumentation systems.

Nuhertz Technologies has provided the capability to optimize synthesized filter circuits with the use of Modelithics® component models, along with Nuhertz filter design software. The Modelithics CLR Library available for AWR Corp.’s Microwave Office® provides the designer access to a huge library of proven-accuracy measurement- based highly scalable equivalent circuit models. 

MiCOM Labs Inc., has released MiTest, a hardware and cloud based computing test system that can accelerate product development release by running regulatory compliance testing in a company’s own design lab.  “MiTest provides manufacturers the ability to consolidate company-wide test processes, enabling flexible in-house compliance testing and certification possibilities for new products,” said Gordon Hurst, president and CEO for MiCOM Labs.

AEM Inc. announces a hirel-qualified Sn/Pb (tin/lead) conversion process designed to mitigate the formation of tin whiskers in surface-mount components. The AEM process eliminates potential damage to sensitive electronic devices caused by conventional hot-solder dippingwhile ensuring that converted component terminations con­tain a minimum of 5 percent Pb as verified by SEM/EDS and XRF inspection methods.

Agilent Technologies Inc. announced the latest release of Electromagnetic Professional (EMPro), its 3-D electromagnetic simulation software.

Intercept Technology Inc., a leading provider of PCB, RF, Hybrid, and high-speed CAD/CAE design software, has joined the ODB++ Solutions Alliance as a demonstration of its continued support for unified CAD/CAM vendor file formats. For over 15 years, Intercept’s Pantheon PCB layout software has offered a variety of manufacturing file formats for its user base, and Intercept remains committed to continuing to support both legacy and new file formats.

UltraSource Inc., an industry leader in delivering thin film on ceramic manufacturing solutions, will be showcasing several of its technologies at this year’s IMS 2013 held at the Washington State Convention Center in Seattle, Washington June 4-6. 

L-3 WESCAM unveiled its new land vehicle surveillance system, the MX™-LVSS, at CANSEC, Canada’s largest defence and security trade show, in the outside display area, booth 2019. Based on L-3 WESCAM’s industry-leading MXSeries of multi-spectral, highly stabilized imaging systems, the MX-LVSS is a modular and rugged solution consisting of low-risk, battle-proven, commercial-off-the-shelf subsystemscurrently operating in the world’s harshest terrains and climates.

Pole/Zero Corp. and Zeger-Abrams Inc. have recently completed an exclusive Technology Transfer and Technology Licensing Agreement covering the entirety of Zeger-Abrams technology and products including: