RF & Microwave Industry News

MIL-STD is standard in KCB booth at IMS 2013

KCB Solutions is pleased to announce a suite of MIL-STD certified products and services for the military, aerospace, and defense market. They’ll be exhibiting in booth #1610 at the International Microwave Symposium in Seattle, WA June 4-6th. Senior staff will be on-hand to answer questions about KCB’s leading edge semiconductor packaging services, manufacturing services and recently launched standardized and fully-screened components.


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Anritsu to showcase test solutions that address high-frequency designs at IMS 2013

Anritsu Co. (booth #938) will display test solutions to meet the high-frequency testing requirements of engineers in the aerospace and defense, communications, and semiconductor industries at IMS 2013 in Seattle, June 4-6. Featured will be the VectorStar Vector Network Analyzer (VNA) platform, which is an ideal solution for device characterization, as well as solutions for measuring components and subsystems used in radar, high-speed serial, microwave backhaul, wireless network, and other applications.  


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Molex to feature products, demos at IMS 2013

Molex Inc. announced that it will exhibit at the IEEE 2013 International Microwave Symposium (IMS) in Seattle, WA, June 2-7.   Molex will showcase its broad range of products and solutions available for the RF/microwave market, including several new products and live product demonstrations, in booth 719.  


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Raytheon books $106 M Paveway II contract

Raytheon Co. booked a $106 million contract for its combat-proven Paveway™ II family of precision-guided munitions. The company was awarded the direct commercial sale from an international customer. The contract includes Paveway kits for both GBU-12 (500lb) and GBU-58 (250lb) guided bombs. Paveway is a Raytheon-designed kit that transforms "dumb" bombs into precision-guided munitions.


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Re-defining device characterization test as Mesuro launches ‘rapid load pull solution’

Mesuro launches a new test solution that provides the industry substantial benefits in approaches to device characterization test. The new offering utilizes an ‘envelope load pull technique’, along with the latest generation of commercial off-the-shelf PXI hardware and LabVIEW system design software from National Instruments, to provide extremely rapid test scenarios to be run on the device under test.


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