RF & Microwave Industry News

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Anritsu Corp. announces its first LTE-Advanced (LTE-A) Carrier Aggregation (CA) test case submissions to RAN 5, demonstrating a strength in protocol conformance that extends across current 2G, 3G, and leading-edge LTE technology. This follows its recent world first in validating RF conformance test cases for CA in PTCRB.  RAN 5 verification paves the way for protocol test validations and the inclusion of this technology in GCF and PTCRB certification.

OEM Capital was asked by Miteq Inc., a privately held technology company, to assist in the sale of its M C L subsidiary to a strategic acquirer.

Nanjing Ericsson Panda Communications (NEPCC), the largest manufacturer of mobile communication base stations and system equipment in Asia, developed a novel quadrature coupled-line hybrid device with the aide of AWR software.

GaN power amplifiers are driving demand for increased power handling from supporting passive components, and Marki Microwave is responding with new high power bias tees and baluns. The new high power surface mount baluns (BALH-0003SMG and BALH-0006SMG) have a 37 dBm 1 dB compression point and improved 5 dB insertion loss (2 dB excess).

A unique feature of the tried and tested R&S NRP power sensors is their ability to work independently of a specific base unit. The sensors can be connected directly to a PC or laptop via USB. Rohde & Schwarz has now implemented this feature for compact smartphones and tablet PCs as well.

MicroGen Systems announced that vibration energy harvesting BOLT™ Power Cells enabled a live wireless sensor network (WSN) using Linear’s Dust Networks LTC5800-IPM SmartMesh™ IP mote-on-chip at the Sensors Expo and Conference exhibition in Rosemont, IL on June 5-6, 2013.

RFMW Ltd. announces application and sales support for the Telemakus LLC TEA13000-12 USB Controlled Digital Attenuator. The TEA13000-12 is used in bench top test or ATE applications and spans a frequency range of 100MHz to 13GHz.

AWR Corp., the innovation leader in high-frequency EDA software, announces a new eBook, RF Electronics: Design and Simulation,which is available free of charge to students, graduates, professors and industry professionals through AWR’s new Professors in Partnership™ web portal.

 Aeroflex Ltd. announced the launch of the TM500 Multi-UE LTE-A Test Mobile, which supports carrier aggregation across multiple mobile terminals or UE. Carrier aggregation, a key component of LTE-A, allows multiple carriers comprised of either contiguous or non-contiguous spectrum to be added together, allowing wider channel bandwidths -- and higher data rates -- to be achieved. 

AVX Corp., a leading manufacturer of passive components and interconnect solutions, has surpassed previous milestones with the introduction of the new TCJ 100V and 125V tantalum polymer capacitors. As the highest rated voltage tantalum capacitors currently on the market, the new surface-mount chip capacitors provide excellent capacitance and ultra-low ESR in a compact case size.