RF & Microwave Industry News

DuPont Circuit & Packaging Materials and IQLP to develop high-speed circuit technology

DuPont Circuit & Packaging Materials (DuPont) and IQLP LLC, a division of Interplex Industries Inc., announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications.  The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.


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Sub-$200 smartphone shipments to exceed 750M in 2018

Low cost smartphones, defined as smartphones with a wholesale ASP below $200, are increasingly appearing in OEM and operator portfolios in both emerging and developed markets. The low hanging fruit for low cost smartphones is to drive smartphone adoption in emerging markets where handset subsidization and disposable income are scarce.  Market intelligence firm ABI Research forecasts low cost smartphone shipments to grow from 238 million in 2013 to 758 million by 2018, driven by the low penetration of smartphones and large subscriber bases found in BRIC countries.


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802.11ac Wi-Fi shipments find biting point in a 43.3M consumer AP market-place

Worldwide consumer Wi-Fi customer premises equipment (CPE) shipments surpassed 43.3 million at the end of 1Q-2013; a 16.8 percent increase from 4Q-2012.  “802.11n device shipments still dominate the market, accounting for more than two thirds of total device shipments; however, 802.11ac access point adoption is starting to gain traction,” says Jake Saunders, VP and practice director of forecasting.


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