RF & Microwave Industry News

e2v aerospace and defense releases microcontroller family to production

e2v aerospace and defense announced that it has completed full qualification of a family of re-engineered 8-bit microcontrollers incorporating the 80C51 CPU architecture. These products have been fully re-engineered and manufactured on a mainstream CMOS process, and are compliant to Defense Logistics Agency (DLA) Standard Microcircuit Drawings (SMDs). These microcontrollers serve as drop-in replacements for a variety of 80C51 architecture devices from original suppliers such as AMD, Atmel, Intel, NXP and Philips, and are widely used in military and aerospace applications.


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SK Telecom and Rohde & Schwarz join hands to develop next-generation antenna technologies

SK Telecom and Rohde & Schwarz plan to build a test bed for active antenna systems (AAS), a smart antenna system developed as part of SK Telecom’s strategy to promote a concept known as SUPER Cell. The aim is to create a stable mobile environment that allows customers to experience faster speeds by enhancing traffic management efficiency through smart antenna systems.


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AWR awards prizes to IMS 2013 student design contest winners

Software/EDA

AWR Corp. gifted its software to the winners of the High Efficiency Power Amplifier (HEPA) and Software Defined Radio (SDR) Student Design Contests offered at the IMS 2013. The gifts are part of the AWR University Program, which encourages students to become involved in the dynamic profession of microwave and RF engineering and to apply their knowledge to practical designs using the highly efficient AWR design methodology.


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China Mobile TD-LTE deployment extended through 2014

Mobile Experts has released updated base station and transceiver forecasts, which indicate a major disruption in the market for China Mobile TD-LTE production. RF semiconductor suppliers are ramping up production which corresponds with delivery of 207,000 TD-LTE base stations. However, despite widespread media reports that 200,000 base stations will be deployed during 2013, industry semiconductor suppliers indicate that production and deployment limitations will stretch deliveries over a period of roughly 18 months.


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