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Altium Ltd., a global leader in Smart System Design Automation, 3D PCB design (Altium Designer) and embedded software development (TASKING) announces the promotion of Martin Harris to chief sales officer (CSO).
Richardson RFPD Inc. announces its attendance and participation at the 2013 International IEEE COMCAS. The annual conference provides a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the areas of microwaves, communications, antennas, solid state circuits, electromagnetic compatibility, electron devices, radar and electronic systems engineering.
Pulse Electronics Corp., a leading provider of electronic components, introduces an ultra-thin near field communications (NFC) ferrite sheet antenna. The antenna is 28 percent thinner than the previous version and still meets the EMVCo specification of 40 mm. It enables NFC connectivity to mobile devices for payment sharing, credential storage and exchange, accessing and controlling data, and wirelessly connecting to tags.
RFMD, a global leader in the design and manufacture of high-performance radio frequency solutions, announced that it has commenced high-volume production of multiple new power amplifiers (PAs) and power management integrated circuits (ICs) that incorporate RFMD's envelope tracking (ET) technology.
Horizon House publications and Microwave Journal China announced that Rohde & Schwarz will be the Diamond sponsor of the Electronic Design Innovation Conference (EDI CON) 2014 in Beijing, China, April 8-10, 2014.
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Thales Alenia Space Belgium announced that it will build a new plant in Leuven, which will start operations in the first half of 2014.