RF & Microwave Industry News

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The smart home appliance market, defined by products with built-in connectivity, will witness substantial growth over the next five years, reaching nearly $25 billion by 2018. Currently limited to the top-end luxury models, wireless connectivity will slowly permeate to lower tier brands and models.

Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.

AVX Corp. announces the availability of new Modelithics models for its 0402 tight tolerance, high current, and high Q multilayer organic (MLO) inductor series. The latest additions to AVX’s Modelithics Component Model Library are part-value sensitive, substrate scalable, and fully integrated with a range of software applications.

Michael Casper, president and CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that they have developed a high density (HD) thin film based ENEPIG process that now combines low cost sputtering, traditional thin film photolithography and etching, and plating with ENEPIG. 

Peregrine Semiconductor Corp. announces the UltraCMOS 10 platform, the newest advancement in Peregrine’s UltraCMOS technology. UltraCMOS 10 RF SOI delivers both flexibility and unparalleled performance for addressing the ever-increasing challenges of RF front-end design.

Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits (MMICs), is introducing a free, easy-to-use, Thermal Analysis tool to their array of web-based calculators. The company offers Attenuator, Image Rejection, Cascade Analysis, and now Thermal calculators.

Indium Corp. will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany. 

AWR Corp., the innovation leader in high-frequency EDA software, announces that it will sponsor the Best Paper Award at the upcoming as well as future Automated RF & Microwave Measurement Society (ARMMS) Conferences in memory of the late AWR European business development manager Steve Evans-Pughe. The ARMMS Best Paper Award titled as “Steve Evans-Pughe Award” will honor the memory of this UK and pan-European RF and microwave industry pioneer.

The elevators in China’s tallest building will support complete wireless communications all the way to the top of the skyscraper because of a high-performance, in-building coverage solution enabled by Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist.