RF & Microwave Industry News

RSS

Peregrine Semiconductor Corp., founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, and GLOBALFOUNDRIES, a leading provider of semiconductor manufacturing technology, are sampling the first RF Switches built on Peregrine’s new UltraCMOS 10 RF SOI technologies. This partnership unites Peregrine’s 25 years of RF SOI experience with a tier-one foundry.

Marking a further milestone during a period of dynamic growth, Microlease, the leading global test equipment management organization, has announced the appointment of Michael E. Clark as its new chief executive officer for the Americas.

General Dynamics Bath Iron Works successfully launched the Navy's first Zumwalt-class destroyer Oct. 28 at its Bath, Maine shipyard. 

The smart home appliance market, defined by products with built-in connectivity, will witness substantial growth over the next five years, reaching nearly $25 billion by 2018. Currently limited to the top-end luxury models, wireless connectivity will slowly permeate to lower tier brands and models.

Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.

AVX Corp. announces the availability of new Modelithics models for its 0402 tight tolerance, high current, and high Q multilayer organic (MLO) inductor series. The latest additions to AVX’s Modelithics Component Model Library are part-value sensitive, substrate scalable, and fully integrated with a range of software applications.

Michael Casper, president and CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that they have developed a high density (HD) thin film based ENEPIG process that now combines low cost sputtering, traditional thin film photolithography and etching, and plating with ENEPIG. 

Peregrine Semiconductor Corp. announces the UltraCMOS 10 platform, the newest advancement in Peregrine’s UltraCMOS technology. UltraCMOS 10 RF SOI delivers both flexibility and unparalleled performance for addressing the ever-increasing challenges of RF front-end design.

Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits (MMICs), is introducing a free, easy-to-use, Thermal Analysis tool to their array of web-based calculators. The company offers Attenuator, Image Rejection, Cascade Analysis, and now Thermal calculators.

Indium Corp. will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany.