RF & Microwave Industry News

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Agilent Technologies Inc. announced that Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, has adopted Agilent EEsof EDA’s Model Builder Program and Model Quality Assurance software. Microchip Technology will use the software to create internal fabrication device model libraries or process design kits, modify external foundry libraries, and validate supported devices from internal and external sources.

Barry Industries introduces an RoHS compliant flange mount termination which dissipates 800 W with minimal return loss over a DC to 1 GHz bandwidth. The thick film on aluminum nitride (AlN) TA50R0-800-15X termination, with its internally matched circuit architecture, has 25 dB or better return loss from DC to 1 GHz. The four-hole flange and input tab are constructed of robust nickel-plated copper. Overall footprint is 1.9” x 1.04”.

Richardson RFPD Inc. announces immediate availability and full design support capabilities for a new diffused metal oxide semiconductor (DMOS) transistor from STMicroelectronics (ST).

Koch Industries Inc. has completed its $7.2 billion acquisition of Molex Inc., a global electronic components company.

The first Boeing Inmarsat-5 satellite has launched and sent signals from orbit, the initial step to establishing Global Xpress, the world’s first globally available high-speed mobile broadband service for government and commercial users.

RFMD Inc., a global leader in the design and manufacture of high-performance radio frequency solutions, announced that the newest flagship Android smartphone incorporates its envelope tracking (ET) power amplifiers (PAs), antenna switch module, diversity switches and antenna tuner. This fifth generation smartphone from a leading Korea-based manufacturer is the slimmest and fastest Android phone to date and the first new smartphone to benefit from the improved power efficiency of RFMD's ET power amplifiers and antenna control solutions.

CEA-Leti announced an agreement with Qualcomm Technologies Inc., a subsidiary of Qualcomm Inc., to assess the feasibility and the value of Leti’s sequential 3D technology.

Ericsson successfully supported Telstra in further enhancing its LTE Advanced (LTE-A) commercial service network as the two companies successfully demonstrated 300 Mbps downlink speeds for data transfer across Telstra's live network.

Soitec has reached high-volume manufacturing of its new Enhanced Signal Integrity™ (eSI) substrates, enabling cost-effective and high-performance RF devices. The eSI products are said to be the first ‘trap-rich’ type of material in full production.

NXP Semiconductors and Datang Telecom Technology Co. Ltd. have established a joint venture that is claimed to be the first true automotive semiconductor company in China.