RF & Microwave Industry News

Isola introduces ultra-low loss materials for applications over 100 Gbps

Isola Group S.à r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced that it has begun alpha testing of Tachyon, its new ultra-low loss product that is engineered to reduce insertion loss on high-peed digital designs. It is specifically being targeted for high-layer count backplanes for the growing 100 gigabit per second (Gbps) market that has channel data rates in excess of 25 Gbps.


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Molex provides medical device design engineers with advanced technology

Molex Inc. is committed to helping medical design engineers meet the growing demand for smaller, more portable devices without sacrificing performance and reliability.  The company will showcase a wide range of its advanced products at MD&M West, February 11 – 13, Anaheim, CA, Booth 1746, including customized interconnects, micro-miniature solutions, optical fiber and capillary tubing and electromagnetic interference (EMI) absorption technology.


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Modelithics welcomes Syfer as MVP and announces new MW Global Model for 0603 high Q capacitors

Modelithics Inc. welcomed Syfer to the Modelithics Vendor Partner (MVP) Program. Syfer and Modelithics have collaborated to develop a Microwave Global Model™ for Syfer’s 0603 case-size High Q Ultra-Low ESR capacitor family. These simulation models are substrate scalable, part-value scalable, pad scalable, and orientation selectable (vertical or horizontal surface-mount).


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Smartphone users worldwide will total 1.75B in 2014

eMarketer expects 4.55 billion people worldwide to use a mobile phone in 2014. Mobile adoption is slowing, but new users in the developing regions of Asia-Pacific and the Middle East and Africa will drive further increases. Between 2013 and 2017, mobile phone penetration will rise from 61.1% to 69.4% of the global population, according to a new eMarketer report, “Worldwide Mobile Phone Users: H1 2014 Forecast and Comparative Estimates.”


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Molex experts showcase products that meet the next wave of advanced technology requirements

Molex Inc. will showcase its deep technical expertise and extensive product portfolio at DesignCon 2014, January 29 – 30, Santa Clara, CA, booth 117.  Company experts will conduct technical paper presentations and product demonstrations to illustrate how Molex solutions meet the demand for increased network bandwidth and advanced technology. The company will also have on display a vast representation of its products that support a wide-range of data rates in a variety of connector sizes and shapes.


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