RF & Microwave Industry News

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With more than two-thirds of the global population expected to live in urban contexts by 2050, the deployment of smart cities technologies and intelligent transportation services in particular, will become key policy areas for local governments.  By 2025, penetration of ITS technologies in smart cities will range from 20% (autonomous vehicles) to 98% (traffic management).

Two downlink antennas that are the fastest of their kind to operate in space are being integrated into the protected communications payload built by Northrop Grumman Corp. for the fourth Advanced Extremely High Frequency (AEHF) satellite.

Signal Sentry 1000, an Exelis product that detects and locates GPS interference sources in 3-D by using longitude, latitude and altitude, was deployed during Super Bowl XLVIII at the MetLife Stadium in East Rutherford, N.J.

The interface of the recently released Molex Inc. zCD™ active optical cable (AOC) interconnect solution has been selected by the industry leading CDFP MSA as the interface for the consortium’s 400 Gbps hot pluggable module.  The zCD AOC assembly will be highlighted at Molex booth 3863, OFC 2014, March 11-13, San Francisco, CA.

TriQuint Semiconductor Inc. announced that its Spatium™ technology achieves unprecedented levels of Ka-Band solid state power, bandwidth and efficiency, which provides greater broadband capacity and opens up new satellite possibilities.

AWR Corp. announces the availability of a free excerpt of the new eBook from Professor Francesco Fornetti, Conquer Radio Frequency – A Multimedia Conceptual Guide to RF and Microwave Engineering. The excerpt includes select Explore RF instructional video tutorials done using AWR’s Microwave Office® circuit design software.

Agilent Technologies Inc. will show test and measurement solutions at the Optical Fiber Communication Conference & Exposition, March 11-13 in San Francisco, CA. Agilent is the only T&M vendor offering solutions along the entire value chain of the Web 2.0—from components through data centers to telecom, addressing the latest technologies such as silicon photonics and coherent, multi-carrier transmission.

Accel-RF Instruments Corp. is the world-leader in supplying equipment for performing measured long-term reliability assessment on compound-semiconductors. To keep up with the shift in GaN from “research novelty” to “market reality”, Accel is expanding its RFBL measurement equipment with the introduction of an 80-Channel RF Bias Burn-In System.

Indium Corp. announces that Tony Teo has been hired as associate director for sales and marketing for the Asia-Pacific region, including China.  

Sonnet Software Inc. introduces Blink™, the first multi-solver passive device modeling suite, now available for purchase. Blink operates entirely from within the Cadence® Virtuoso® environment and is used for the analysis of on-chip passive devices such as spiral inductors and MIM capacitors.