RF & Microwave Industry News

RSS

Advantech Wireless Inc., a privately-held Canadian corporation and manufacturer of satellite, RF equipment and microwave systems announced that it has successfully completed the delivery of the New SapphireBlu^TM Series 6.6kW X-Band Rackmount UltraLinear^TM GaN SSPA/BUC, the ultimate solution for wide bandwidth, ultra high power satellite teleport uplinks.

Auriga announced that Agilent Technologies Inc. has designated Auriga Microwave a Global Solutions Partner, Agilent's highest level status for their Solution Partner program.

Cornell Dubilier Electronics Inc. (CDE) announced it has expanded its line of MLS flatpack aluminum electrolytic capacitors to include a high vibration package, type HVMLS and a high reliability burn-in option, type HRMLS.

Agilent Technologies Inc. announced a series of enhancements for its MXA and EXA X-Series signal analyzers. The enhancements are ideal for engineers performing wireless communications and general-purpose testing at various phases of the product life cycle, from R&D and design verification to manufacturing and installation.

Remtec Inc., the leading manufacturer of substrates and packages using plated copper on thick film (PCTF) metallization, has adapted its gold-tin plating technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and microwave electronic components, lead frames and other miniature parts on high frequency PC boards.

Indium Corp. technology experts will present at PCIM Europe May 20–22 in Nuremberg, Germany

With over 2.6 billion chipsets expected to ship during 2014, Wi-Fi is currently the most ubiquitous wireless connectivity technology for Internet access. As the technology continues to adapt and expand with new protocols such as 802.11ac, 802.11ax, 802.11ad (WiGig), and Wi-Fi Direct, nearly 18 billion more chips will ship cumulatively from 2015 to 2019.

AVX Corp., a leading manufacturer of advanced passive components and interconnect solutions, has introduced two new wideband, 3dB, 90° hybrid couplers: a 2100MHz device for 1.5 – 2.1GHz performance and a 2700MHz device for 2.1 – 2.7GHz performance.

In preparation for ship-board flights this spring, the Northrop Grumman Corp.-built MQ-8C Fire Scout will be tested for its ability to operate safely in the intense electromagnetic environment aboard U.S. Navy ships.

Agilent Technologies Inc. announced an enhancement to the Agilent 14585A control and analysis software for advanced power supplies, adding support for the N7900 Advanced Power System (APS) dynamic DC power supplies.