RF & Microwave Industry News

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T-Tech Inc. and The Geek Group announced a joint agreement to offer a state of the art solution and facility for rapid printed circuit board (PCB) design, verification, and fabrication. The collaboration will combine T-Tech's QCJ5 series Quick Circuit System and IsoPro® Software for PCB prototyping with The Geek Group's expertise and 43,000 square foot Leonard Street Labs Facility in Grand Rapids, Michigan.

Soitec, a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, and Shanghai Simgui Technology Co. Ltd., a Chinese silicon-based semiconductor materials company, have formed an international partnership to address both China's growing demand and limited worldwide production capacity for 200-mm silicon-on-insulator (SOI) wafers used in fabricating semiconductors for radio-frequency (RF) and power applications.

Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, announces the availability of new models of its low PIM directional couplers and power dividers. Designed to support in-building and in-tunnel wireless applications using DAS systems, the latest products from RFS provide a cost-effective way to divide and distribute power as needed.

CTS Corporation, through its subsidiary, CTS Electronic Components, Inc., announces its new Model 149, a small size oven-controlled crystal oscillator (OCXO), that operates at temperatures suitable for commercial and industrial use. CTS introduced the new precision OCXO along with the company’s other cutting-edge offerings at the IEEE International Microwave Symposium (IMS) in Tampa, Fla., June 3-5 at booth number 322.

Diamond Microwave, a specialist in high performance microwave power amplifiers, is extending its range of GaN-based solid-state power amplifiers (SSPA) to include a 2 - 6GHz model that can be operated in either pulsed or CW mode.

 

Vectron International, a leader in the design and manufacture of precision oscillators and timing solutions for communication, industrial, military & space applications, announced the release of a low g-sensitivity TCXO for military, industrial and other harsh environment applications. This product will be showcased in Booth 1305 at the IMS 2014 Symposium in Tampa, FL from June 3-5th 2014.

Granite River Labs (GRL), a USB-IF authorized test center, today announced the USB 3.0 Protocol Performance and Stress Test Software Suite (GRL-USB3-PROTO). GRL-USB3-PROTO allows USB developers quickly optimize the performance and robustness of their USB 3.0 products in development while unlocking the full potential of their Teledyne LeCroy Voyager USB 3.0 Analyzer/Exerciser.

Cirexx International is presenting the new ECLIPS technology this week at the International Microwave Symposium (IMS) at the Tampa Convention Center.  ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF and microwave Printed Circuit Boards (PCBs) employing an embedded low-CTE, thermally engineered metalized layer which has superior thermal conductivity characteristics.

Indium Corporation's vice president of technology, Dr. Ning-Cheng Lee, will share his expertise at the International Union of Materials Research Societies – International Conference on Electronic Materials (IUMRS-ICEM) from June 10-14 at Taipei World Trade Center Nangang Exhibition Hall in Taipei, Taiwan.

Georgios Sklivanitis and Emrecan Demirors with the Software Defined Networks (SDN) Lab in the Department of Electrical Engineering of the State University of New York at Buffalo have won Nutaq's 2014 Software Defined Radio Academic US Contest.