RF & Microwave Industry News

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Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, announces the availability of new models of its low PIM directional couplers and power dividers. Designed to support in-building and in-tunnel wireless applications using DAS systems, the latest products from RFS provide a cost-effective way to divide and distribute power as needed.

CTS Corporation, through its subsidiary, CTS Electronic Components, Inc., announces its new Model 149, a small size oven-controlled crystal oscillator (OCXO), that operates at temperatures suitable for commercial and industrial use. CTS introduced the new precision OCXO along with the company’s other cutting-edge offerings at the IEEE International Microwave Symposium (IMS) in Tampa, Fla., June 3-5 at booth number 322.

Diamond Microwave, a specialist in high performance microwave power amplifiers, is extending its range of GaN-based solid-state power amplifiers (SSPA) to include a 2 - 6GHz model that can be operated in either pulsed or CW mode.

 

Vectron International, a leader in the design and manufacture of precision oscillators and timing solutions for communication, industrial, military & space applications, announced the release of a low g-sensitivity TCXO for military, industrial and other harsh environment applications. This product will be showcased in Booth 1305 at the IMS 2014 Symposium in Tampa, FL from June 3-5th 2014.

Granite River Labs (GRL), a USB-IF authorized test center, today announced the USB 3.0 Protocol Performance and Stress Test Software Suite (GRL-USB3-PROTO). GRL-USB3-PROTO allows USB developers quickly optimize the performance and robustness of their USB 3.0 products in development while unlocking the full potential of their Teledyne LeCroy Voyager USB 3.0 Analyzer/Exerciser.

Cirexx International is presenting the new ECLIPS technology this week at the International Microwave Symposium (IMS) at the Tampa Convention Center.  ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF and microwave Printed Circuit Boards (PCBs) employing an embedded low-CTE, thermally engineered metalized layer which has superior thermal conductivity characteristics.

Indium Corporation's vice president of technology, Dr. Ning-Cheng Lee, will share his expertise at the International Union of Materials Research Societies – International Conference on Electronic Materials (IUMRS-ICEM) from June 10-14 at Taipei World Trade Center Nangang Exhibition Hall in Taipei, Taiwan.

Georgios Sklivanitis and Emrecan Demirors with the Software Defined Networks (SDN) Lab in the Department of Electrical Engineering of the State University of New York at Buffalo have won Nutaq's 2014 Software Defined Radio Academic US Contest.

Rigol Technologies, Inc. announces their latest series of products: two new high-performance, high frequency spectrum analyzers built on the extremely popular DSA800 series platform. The DSA832 and DSA875 expand the DSA800 series spectrum analyzer family to 3.2 and 7.5 GHz respectively. With specifications that far exceed the DSA815-TG these new instruments enable direct measurements of higher performance signals and systems.

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance RF, microwave, and millimeter wave products, announced that its wafer fabrication facility in Lowell, Massachusetts, has been accredited by the Department of Defense (DoD) as a Category 1A Trusted Foundry. This DoD accreditation distinguishes MACOM as a trusted manufacturer of integrated circuits (ICs) for classified and unclassified U.S. military and aerospace applications.